Coalescence kinetics and microstructure evolution of Cu nanoparticles sintering on substrates: a molecular dynamics study

Nano copper sintering technology has great potential to be widely applied in the wide-bandgap semiconductor packaging. In order investigate coalescence kinetics of nano particles for this application, a molecular dynamic (MD) simulation was carried out at low temperature on special model containing two substrate and multiple between. Accordingly, thorough microstructure dislocation investigation conducted identify atomic-scale evolution system. The corresponding findings could provide evidence new particle-substrate mechanism. Furthermore, atomic trajectories tracking method study rotation behavior different sized particles. New mechanism were described. Additionally, size effect process via comparing microstructural distribution 3 nm, 4 nm 5 models. Finally, by MSD results high each model, dominant dynamics changes obtained.